Failure analysis and prevention are key functions to all of engineering disciplines. Whether a part or product fails in service, or failure occurs in manufacturing or during production processing, we must determine the root cause of failure to prevent future occurrence, and to improve the performance of the equipment, module, and structure.

Computational Engineering, Inc. has extensive experience in performing failure analysis and root cause determination on a wide range of parts and products (ball grid arrays, printed wiring boards, photodiodes, plastic encapsulated microcircuits, connectors, flip-chips, etc.) and identifying a wide range of failure mechanisms (solder joint fatigue, poor plating, conductive filament formation, over-etching of via walls, electrostatic discharge, etc.).

At Computational Engineering, Inc., we use systematic approaches to investigate failure to determine its cause and to consequently improve product reliability. Through failure analysis, we can identify:

• Failure Modes (the way the product failed to perform);
• Failure Site (where in the product failure occurred);
• Failure Mechanism (physical phenomena involved in failure);
• Root Cause (design, material, process, defect, or loads);

And hence, we recommend failure prevention methods.

Design failure causes business millions of dollars of business, hinders its new idea and invention realization, pulls a star product back from market shelves, damages a company’s brand values, and even threats a business health and survival.

Not anymore, our experts at Computational Engineering Inc. can help you prevent and resolve the problem by providing:

• Failure Analysis of Electronic Devices
• Failure Analysis of Medical Devices
• Failure Analysis of Ceramics and Plastics